| Cu-Fe_(64)Ni_(36)合金显微组织及热膨胀性能研究; Investigation on the Microstructures and Thermal Expansion Characteristics of Cu-Fe_(64)Ni_(36) Alloys | |
| 刘兴军 ; 何洲峰 ; 施展 ; 杨水源 ; 王翠萍 | |
| 2014-07-28 | |
| 关键词 | Cu-Fe-Ni 相图 显微组织 热膨胀系数 Cu-Fe-Ni phase diagram microstructure thermal expansion coefficient |
| 英文摘要 | 基于Cu-fE-nI三元系的计算相图设计制备了不同Cu质量分数的Cu-fE64nI36三元合金.通过电子探针仪、光学显微镜和热机械分析仪研究了淬火温度(1 000,1 100℃)及时效温度(600,700,800℃)对合金的微观组织和热膨胀性能的影响.研究结果表明:CuX(fE0.64nI0.36)100-X(X%,(100-X)%均为质量分数)合金在1 000℃保温24H淬火并在600℃时效100H后,其热膨胀系数明显减小.其中,Cu30(fE0.64nI0.36)70合金热膨胀系数为6.26x10-6℃-1,可以与电子封装中半导体材料的热膨胀系数相匹配.; Based on the present calculated Cu-Fe-Ni ternary phase diagram,several Cu-Fe64Ni36ternary alloys with different copper contents were designed and prepared.In this study,the influence of quenching temperature(1 000,1 100℃)and aging temperature(600,700,800℃)on microstructures and thermal expansion coefficients(CTE)of the prepared alloys were investigated by electron probe micro-analysis,optical microscopy,and thermomechanical analyzer.The result shows that the CTE of the alloys after quenching at 1 000℃and aging at 600℃decrease obviously.Particularly,the Cu30(Fe0.64Ni0.36)70(30%,70%,by mass)alloy after heat treatment has a low CTE of 6.26×10-6℃-1,which can well match with that of semiconductor in electronic packaging.; 国家自然科学基金重点项目(51031003); 教育部博士学科点专项科研基金(20120121130004) |
| 语种 | zh_CN |
| 内容类型 | 期刊论文 |
| 源URL | [http://dspace.xmu.edu.cn/handle/2288/98443]  |
| 专题 | 材料学院－已发表论文 |
| 推荐引用方式 GB/T 7714 | 刘兴军,何洲峰,施展,等. Cu-Fe_(64)Ni_(36)合金显微组织及热膨胀性能研究, Investigation on the Microstructures and Thermal Expansion Characteristics of Cu-Fe_(64)Ni_(36) Alloys[J],2014. |
| APA | 刘兴军,何洲峰,施展,杨水源,&王翠萍.(2014).Cu-Fe_(64)Ni_(36)合金显微组织及热膨胀性能研究.. |
| MLA | 刘兴军,et al."Cu-Fe_(64)Ni_(36)合金显微组织及热膨胀性能研究".(2014). |
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