Thermodynamic calculation of phase equilibria in the Sn-Ag-Cu-Ni-Au system

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	Thermodynamic calculation of phase equilibria in the Sn-Ag-Cu-Ni-Au system
	Liu, X. J. ; Wang, C. P. ; Gao, F. ; Ohnuma, I. ; Ishida, K. ; Liu XJ(刘兴军)
刊名	http://dx.doi.org/10.1007/s11664-007-0247-9
	2007-09
关键词	LEAD-FREE SOLDERS TERNARY-SYSTEM INTERFACIAL REACTIONS QUATERNARY-SYSTEM LIQUID ALLOYS CU/NI COUPLES RICH CORNER DIAGRAMS ENTHALPIES OPTIMIZATION
英文摘要	Sn-Ag-Cu base solders are the most promising candidates to substitute for Sn-Pb eutectic solder. Gold (Au) coatings are used to protect conductor surfaces from oxidation and thereby to promote solderability, and Ni is often used as a diffusion barrier layer between lead-free solders and substrates to restrict the growth of intermetallic compound layers. In the present work, thermodynamic calculations of phase equilibria in the Sn-Ag-Cu-Ni-Au system, which is of importance for developing lead-free solders, are carried out using the calculation of phase diagrams (CALPHAD) method. Substitutional solution and sublattice models are used to describe the solution and intermediate phases, respectively. Some examples of thermodynamic calculation are presented, and it is shown that the phase diagrams, liquidus projection, and thermodynamic properties can be predicted based on the present calculations.
语种	英语
内容类型	期刊论文
源URL	[http://dspace.xmu.edu.cn/handle/2288/59163]
专题	材料学院－已发表论文
推荐引用方式 GB/T 7714	Liu, X. J.,Wang, C. P.,Gao, F.,et al. Thermodynamic calculation of phase equilibria in the Sn-Ag-Cu-Ni-Au system[J]. http://dx.doi.org/10.1007/s11664-007-0247-9,2007.
APA	Liu, X. J.,Wang, C. P.,Gao, F.,Ohnuma, I.,Ishida, K.,&刘兴军.(2007).Thermodynamic calculation of phase equilibria in the Sn-Ag-Cu-Ni-Au system.http://dx.doi.org/10.1007/s11664-007-0247-9.
MLA	Liu, X. J.,et al."Thermodynamic calculation of phase equilibria in the Sn-Ag-Cu-Ni-Au system".http://dx.doi.org/10.1007/s11664-007-0247-9 (2007).