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	Simulation of interface structure influence on in-plane thermal conductivity of Ar-like nano films by molecular dynamics
	Liang, X.G. ; Yue, B. ; Maruyama, S.
	2010-10-12 ; 2010-10-12
关键词	Theoretical or Mathematical/ heat transfer interface phonons interface structure molecular dynamics method nanostructured materials thermal conductivity thin films/ interface structure in-plane thermal conductivity Ar-like nano films molecular dynamics interface thermal resistance heat transport composite nanostructures phonon mismatch interface microstructure monolayer film/ A6670 Nonelectronic thermal conduction and heat-pulse propagation in nonmetallic solids A6848 Solid-solid interfaces A6322 Phonons in low-dimensional structures and small particles
中文摘要	Interface thermal resistance is extremely important for heat transport in composite nanostructures. The micro interface resistance originated from phonon mismatch plays a significant role in nanostructures. It depends on various factors including microstructure of interfaces. In fact the interface thermal resistance is not an intrinsic property of nanostructures. This work investigates the influence of staggered atom replacements across interfaces on the effective in-plane thermal conductivity of a dual-layered composite film and a monolayer film using molecular dynamics (MD). A parameter, the staggered number density is defined which is the ratio of the number of staggered lattice sites across interface over the whole lattice sites on the interface plane. The effects of the staggered number density and the height of the staggered sites are investigated. An interesting result is that the effective in-plane thermal conductivity varies with the staggered number density non-monotonically. With increasing number density the conductivity first decreases and then increases. The thermal conductivity is found to decrease with increasing staggered height. The mechanism of these phenomena is discussed.
语种	英语
出版者	Begell House Inc. ; USA
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/79112]
专题	清华大学
推荐引用方式 GB/T 7714	Liang, X.G.,Yue, B.,Maruyama, S.. Simulation of interface structure influence on in-plane thermal conductivity of Ar-like nano films by molecular dynamics[J],2010, 2010.
APA	Liang, X.G.,Yue, B.,&Maruyama, S..(2010).Simulation of interface structure influence on in-plane thermal conductivity of Ar-like nano films by molecular dynamics..
MLA	Liang, X.G.,et al."Simulation of interface structure influence on in-plane thermal conductivity of Ar-like nano films by molecular dynamics".(2010).

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