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	电解刻蚀集流体铜箔对负极性能的影响
	樊星 ; 郑永平 ; 沈万慈 ; FAN Xing ; ZHENG Yong-ping ; SHEN Wan-ci
	2010-06-10 ; 2010-06-10
关键词	集流体 铜箔 电解刻蚀 纳米硅 微晶石墨 负极 current collector Cu foil electrolytic etching nano-Si microcrystalline graphite anode TM912.9
其他题名	Influence of electrolytic etching currentcollector Cu foil on the performance of anode
中文摘要	用扫描电镜、交流阻抗谱和恒流充放电等方法,分析了电解刻蚀集流体铜箔对纳米硅和微晶石墨负极性能的影响。电解刻蚀后,铜箔表面形成了沟壑式形貌,与负极材料紧密接触;以0.1C充放电,纳米硅和微晶石墨负极的首次充放电效率分别提高了7.0%和7.3%,第30次循环的放电比容量分别从192 mAh/g、325 mAh/g提高到217 mAh/g3、58 mAh/g。; The influences of electrolytic etching current collector Cu foil on the electrochemical performance of nano-Si and microcrystalline graphite anodes were analyzed by SEM,EIS and galvanostatic charge-discharge methods.After electrolytic etching,the morphology of homogeneous ravine was formed on the surface of Cu foils,which gave a tighter contact with the anode materials,when charge-discharge at 0.1 C,the initial charge-discharge efficiencies of nano-Si and microcrystalline graphite anodes were increased 7.0% and 7.3%,respectively,the specific discharge capacities at the 30th cycle were increased from 192 mAh/g and 325 mAh/g to 217 mAh/g and 358 mAh/g,respectively.; “十一五”科技支撑计划项目(2008BAE60B00)
语种	中文 ; 中文
内容类型	期刊论文
源URL	[http://hdl.handle.net/123456789/61429]
专题	清华大学
推荐引用方式 GB/T 7714	樊星,郑永平,沈万慈,等. 电解刻蚀集流体铜箔对负极性能的影响[J],2010, 2010.
APA	樊星,郑永平,沈万慈,FAN Xing,ZHENG Yong-ping,&SHEN Wan-ci.(2010).电解刻蚀集流体铜箔对负极性能的影响..
MLA	樊星,et al."电解刻蚀集流体铜箔对负极性能的影响".(2010).

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