| Preparation of raspberry-like SiO2 nanoparticles and thermo-mechanical properties of its epoxy composites | |
| Huang, Liang; Li, Gang; Zhu, Pengli; Sun, Rong; Lu, Daoqiang Daniel; Wong, Chingping | |
| 2014 | |
| 会议名称 | Proceedings of the Electronic Packaging Technology Conference, EPTC, |
| 会议地点 | 中国 |
| 英文摘要 | Raspberry-like SiO2 (R-SiO2) nanoparticles were prepared by electrostatic self-assembly of two different sizes SiO2 nanoparticles under the help of polyelectrolytes, which would be removed by further calcination. The R-SiO2/epoxy composites were fabricated then by a solvent-free curing process. The morphology of R-SiO2 and fracture morphology of their epoxy composites were observed by scanning electron microscopic (SEM). Thermo-mechanical properties including storage modulus, glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are critical properties for SiO2/epoxy composites. To observe these parameters, dynamic mechanical analysis (DMA) and thermomechanical analysis (TMA) were used, respectively. The results showed that the R-SiO2 particles could be used as effective fillers on increasing Tg and decreasing CTE of the epoxy composites. |
| 收录类别 | EI |
| 语种 | 英语 |
| 内容类型 | 会议论文 |
| 源URL | [http://ir.siat.ac.cn:8080/handle/172644/5632]  |
| 专题 | 深圳先进技术研究院_集成所 |
| 作者单位 | 2014 |
| 推荐引用方式 GB/T 7714 | Huang, Liang,Li, Gang,Zhu, Pengli,et al. Preparation of raspberry-like SiO2 nanoparticles and thermo-mechanical properties of its epoxy composites[C]. 见:Proceedings of the Electronic Packaging Technology Conference, EPTC,. 中国. |
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