Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant

CORC > 上海有机化学研究所 > 中国科学院上海有机化学研究所 > 高分子材料研究室

	Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant
	Wang YQ(王元强)1; Sun J(孙晶)1; Jin KK(金凯凯)1; Wang JJ(王佳佳)1; Yuan C(袁超)1; Tong JW(童佳伟)1; Diao S(刁屾)1; He FK(贺凤开)1; Fang Q(房强)1
刊名	RSC Adv.
	2014
卷号	4 期号:75 页码:39884-39888
其他题名	Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant
通讯作者	刁屾 ; 房强
英文摘要	A fluorene-based monomer (FB) with thermally cross-linkable benzocyclobutene groups is reported here. This monomer showed good solubility in the common organic solvents and had a low melting point (128 degrees C). When being treated at high temperature (>200 degrees C), the monomer was converted to a crosslinked network structure (PFB). TGA data exhibited that PFB had high thermostability with a 5% weight loss temperature of 437 degrees C and 372 degrees C in N-2 and air, respectively. Moreover, PFB showed a char yield of 47.6% at 1000 degrees C in N-2. With regard to the electrical properties, PFB indicated an average of dielectric constants of about 2.7 ranging from 0.15 MHz to 30 MHz. All these results suggest that FB could be used as the varnish for insulating enameled wire in the electrical industry, and as encapsulation resins in the microelectronics industry.
学科主题	高分子化学
收录类别	SCI
原文出处	http://dx.doi.org/10.1039/c4ra05898d
语种	英语
内容类型	期刊论文
源URL	[http://ir.sioc.ac.cn/handle/331003/38904]
专题	上海有机化学研究所_高分子材料研究室
作者单位	1.中科院上海有机化学研究所 2.烟台大学
推荐引用方式 GB/T 7714	Wang YQ,Sun J,Jin KK,et al. Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant[J]. RSC Adv.,2014,4(75):39884-39888.
APA	王元强.,孙晶.,金凯凯.,王佳佳.,袁超.,...&房强.(2014).Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant.RSC Adv.,4(75),39884-39888.
MLA	王元强,et al."Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant".RSC Adv. 4.75(2014):39884-39888.